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Panasonic

Home>Product>SMT Pick And Place Machine>Panasonic

Product name：
Panasonic Pick and place machine NPMD3
Product Feature

Quick-change feeder carts, nozzl...

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Description

Specifications

Model ID
 NPM-D3
Rear head
Front head
 Lightweight
16-nozzle head
 12-nozzle head
 8-nozzle head
 2-nozzle head
 Dispensing head
 No head
Lightweight 16-nozzle head
 NM-EJM6D
 NM-EJM6D-MD
 NM-EJM6D
12-nozzle head
8-nozzle head
2-nozzle head
Dispensing head
 NM-EJM6D-MD
NM-EJM6D-D
Inspection head
 NM-EJM6D-MA
 NM-EJM6D-A
No head
 NM-EJM6D
 NM-EJM6D-D

PCB
dimensions*1
(mm)
 Dual-lane
mode
 L 50 x W 50 ~ L 510 x W 300
Single-lane
mode
 L 50 x W 50 ~ L 510 x W 590
PCB
exchange
time
 Dual-lane
mode
 0 s* *No 0s when cycle time is 3.6 s or less
Single-lane
mode
 3.6 s* *When selecting short conveyors
Electric source
 3-phase AC 200, 220, 380, 400, 420, 480 V 2.7 kVA
Pneumatic source *2
 0.5 MPa, 100 L /min (A.N.R.)
Dimensions *2 (mm)
 W 832 x D 2 652 *3 x H 1 444 *4
Mass
 1 680 kg (Only for main body:This differs depending on the option configuration.)

Placement head
 Lightweight 16-nozzle head
(Per head)
 12-nozzle head
(Per head)
 8-nozzle head
(Per head)
 2-nozzle head
(Per head)
High production mode [ON]
 High production mode [OFF]
Max. speed
 42 000 cph
(0.086 s/ chip)
 38 000 cph
(0.095 s/ chip)
 34 500 cph
(0.104 s/ chip)
 21 500 cph
(0.167 s/ chip)
 5 500 cph
(0.655 s/ chip)
4 250 cph
(0.847 s/ QFP)
Placement accuracy
(Cpk1)
 ± 40 µm/chip
 ±30 μm / chip
(±25 μm / chip*5)
 ±30 μm / chip
 ± 30 µm/chip
± 30 µm/QFP
12mm to 32mm
± 50 µm/QFP
12mm Under
± 30 µm/QFP
Component
dimensions
(mm)
 0402 chip*6 to L 6 x W 6 x T 3
 03015*6*7/0402 chip*6 to L 6 x W 6 x T 3
 0402 chip*6 to L 12 x W 12 x T 6.5
 0402 chip*6 to L 32 x W 32 x T 12
 0603 chip to L 100 x W 90 x T 28
Component
supply
 Taping
 Tape : 4 / 8 / 12 / 16 / 24 / 32 / 44 / 56 mm
 Tape : 4 to 56 / 72 / 88 / 104 mm
Taping
 Max. 68 (4, 8 mm tape, Small reel)
Stick
Max.16 (Single stick feeder)
Tray
Max.20 (per tray feeder)


Dispensing head
 Dot dispensing
 Draw dispensing
Dispensing speed
 0.16 s/dot (Condition : XY=10 mm, Z=less than 4 mm movement, No θ rotation)
 4.25 s/component (Condition: 30 mm x 30 mm corner dispensing)*8
Adhesive position accuracy
(Cpk1)
 ± 75 μ m /dot
 ± 100 μ m /component
Applicable components
 1608 chip to SOP,PLCC,QFP, Connector, BGA, CSP
 SOP,PLCC,QFP, Connector, BGA, CSP


Inspection head
 2D inspection head (A)
 2D inspection head (B)
Resolution
 18 µm
 9 µm
View size (mm)
 44.4 x 37.2
 21.1 x 17.6
Inspection
processing
time
 Solder
Inspection *9
 0.35s/ View size
Component
Inspection *9
 0.5s/ View size
Inspection
object
 Solder
Inspection *9
 Chip component : 100 μm x 150 μm or more (0603 mm or more)
Package component : φ150 μm or more
 Chip component : 80 μm x 120 μm or more (0402 mm or more)
Package component : φ120 μm or more
Component
Inspection *9
 Square chip (0603 mm or more), SOP, QFP (a pitch of 0.4 mm or more), CSP, BGA, Aluminum electrolysis capacitor, Volume, Trimmer, Coil, Connector*10
 Square chip (0402 mm or more), SOP, QFP (a pitch of 0.3 mm or more), CSP, BGA,Aluminum electrolysis capacitor, Volume, Trimmer, Coil, Connector*10
Inspection
items
 Solder
Inspection *9
 Oozing, blur, misalignment, abnormal shape, bridging
Component
Inspection *9
 Missing, shift, flipping, polarity, foreign object inspection *11
Inspection position accuracy *12
( Cpk1)
 ± 20 μm
 ± 10 μm
No. of
inspection
 Solder
Inspection *9
 Max. 30 000 pcs./machine (No. of components : Max. 10 000 pcs./machine)
Component
Inspection *9
 Max. 10 000 pcs./machine

*1 :

Due to a difference in PCB transfer reference, a direct connection with NPM (NM-EJM9B) / NPM-W (NM-EJM2D) /NPM-W2 (NM-EJM7D) dual lane specs cannot be established.
*2 : Only for main body
*3 : Dimension D including tray feeder : 2 683 mm
Dimension D including feeder cart : 2 728 mm
*4 : Excluding the monitor, signal tower and ceiling fan cover.
*5 : ±25 μm placement support option.(Under conditions specified by Panasonic)
*6 : The 03015/0402 mm chip requires a specific nozzle/feeder.
*7 : Support for 03015 mm chip placement is optional.(Under conditions specified by Panasonic:Placement accuracy ±30 μm / chip )
*8 : A PCB height measurement time of 0.5s is included.
*9 : One head cannot handle solder inspection and component inspection at the same time.
*10 : Please refer to the specification booklet for details.
*11 : Foreign object is available to chip components. (Excluding 03015 mm chip)
*12 : This is the solder inspection position accuracy measured by our reference using our glass PCB for plane calibration. It may be affected by sudden change of ambient temperature.

*Placement tact time, inspection time and accuracy values may differ slightly depending on conditions
*Please refer to the specification booklet for details.


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