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Product name:
SFG Solder Paste Inspection System 63X series
Product Feature
Principle
Using phase modulation profile measurement technology to achieve three-dimensional measurement of precision printed solder paste, while ensuring high-speed measurement, greatly improving measurement accuracy
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Description

Apply deep learning algorithms in the field of industrial inspection, use big data optimization, intelligent minimalist programming, one-click automatic identification of light board pads, poor intelligent judgment, and solve the two traditional algorithm pain points of long programming time and high false alarm rate

Specifications

SIS630P

Save personnel, can replace visual inspection station

Improve quality and reduce solder joint defects in the printing process to flow into the next process
Data tracing, a large amount of data statistics and analysis, improve the quality of controlled products
PCBA specification size: 50x50mm~510*460mm
SIS 630P-D
Save personnel, can replace visual inspection station
Improve quality and reduce solder joint defects in the printing process to flow into the next process
Data tracing, a large amount of data statistics and analysis, improve the quality of controlled products
PCBA Size: Single rail  50*50mm~510*610mm 
Double rail 50*50mm~510*330mm

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