Product

PCB

Application

Application process

After stencil printing, after/before hot air reflow

Can test both sides and multiple PCBs simultaneously

PCB dimension

20×20mm-450×350mm

PCB thickness

0.3-5.0mm

PCB space

top：≤30mm；bottom:≤45mm

Inspection items

Visual system

After stencil printing

Solder paste unavailability, insufficient or excessive solder paste, solder paste misalignment, solder paste bridging, stain , scratch and so on.

Before or after reflow soldering

Missing or excessive component, misalignment, uneven, edging defect, opposite mounting , wrong polarity, wrong or bad components.

Before or after DIP wave soldering

Excessive or missing component, empty soldering, solder balls, solder misalignment, edging defect, bridging, IC NG, copper stain etc.

Image system

CCD camera, German Basler 500 million px

Lighting system

Three-channel white led light source or RGB light source

Resolution ratio

18um(FOV dimension：28.8 mm×21.6 mm)

Inspection mode

Color calculation, color extraction, gray-scale operations, image

matching, etc

Mechanical system

X/Y driving system

AC servo motor, Precision grinding ball screw

PCB fixing mode

Auto fixture

Positioning accuracy

<8 um

Moving speed

800mm/s(MAX)